Multilayer PCB Has Even more Than Two Conductive Copper Layers

By | February 25, 2021

Multilayer PCB has more than two conductive copper levels which mainly are made up of inner coating cores, prepreg tiers and copper foils and they? lso are melted together by means of heat and strain. Lamination process is among the key to handle top quality of multilayer PCB, this procedure requires specific heating system and pressure regarding specific amounts of time centered on materials accustomed to ensure the PCB board is manufactured properly.

The multilayer PCB is the development of the particular double sided PCB with increasing complexity and density associated with components, they permitted the designers to be able to produce highly complicated and compact circuits and further growth of blind in addition to buried via opening technology has pressed these limits even further.

With typically the requirements of higher precision in several apps, the demands associated with multilayer PCB retain increasing continuously recently. The typical applications of multilayer published circuit boards include Computers, Data storage, Cell phone transmitting, GPS technology, satellite systems and thus on.

A-TECH will be an experienced multilayer PCB manufacturer which often own complete multilayer PCB manufacturing procedure in house from inner layer, vacuum lamination to area finishes, it brings us more benefits in the competitors of global marketplace shares for multilayer printed circuit panels on quality, value and lead moment. The proportion regarding multilayer PCB we manufactured is more than 65%.

HDI PCB, the full brand is High Density Connect PCB, it needs very much higher wiring thickness with finer search for and spacing, smaller vias and higher connection pad density. Blind and buried vias? design any of their designated feature. multilayer pcb HDI PCB are widely applied for Cellular phone, capsule computer, digital camera, GPS, LCD module plus other different area.

A-TECH CIRCUITS provides HDI PCB production services to globally customers in the particular top end automotive market, medical computer industry, mobile, computing plus defense industry.

Currently the advanced HDI technology we applied include: “Direct Laser Drill”(DLD) is drilling of copper layer by direct CARBON DIOXIDE laser irradiation, out-do additional laser drilling with conformal mask, the copper primary laser drilling is capable of providing higher accuracy, better gap quality and better efficiency for HDI projects. “Copper Filled” for special collection microvia, “Laser Direct Imaging”(LDI) is specifically designed for great line technology, in order to eliminate dimensional balance problem of art work caused by ecological and material issues.